Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

M. Y. Tsai; C. Y. Huang; C. W. Ting; Kuo Shu Kao; Ming Yao Chen; Jimmy Tsang; Sheng Shu Yang; Cho Chyun An; Shyh Ming Chang

doi:10.1109/IMPACT.2007.4433578

Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

M. Y. Tsai, C. Y. Huang, C. W. Ting, Kuo Shu Kao, Ming Yao Chen, Jimmy Tsang, Sheng Shu Yang, Cho Chyun An, Shyh Ming Chang

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony ) in TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

Original language	English
Title of host publication	Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
Pages	106-109
Number of pages	4
DOIs	https://doi.org/10.1109/IMPACT.2007.4433578
State	Published - 2007
Event	2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT - Taipei, Taiwan Duration: 01 10 2007 → 03 10 2007

Publication series

Name	Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Conference

Conference	2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
Country/Territory	Taiwan
City	Taipei
Period	01/10/07 → 03/10/07

Access to Document

10.1109/IMPACT.2007.4433578

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Tsai, M. Y., Huang, C. Y., Ting, C. W., Kao, K. S., Chen, M. Y., Tsang, J., Yang, S. S., An, C. C., & Chang, S. M. (2007). Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. In Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT (pp. 106-109). Article 4433578 (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2007.4433578

Tsai, M. Y. ; Huang, C. Y. ; Ting, C. W. et al. / Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. 2007. pp. 106-109 (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT).

@inproceedings{6f297da95f764454a2fd92fdf16995a4,

title = "Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads",

abstract = "The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony ) in TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.",

author = "Tsai, {M. Y.} and Huang, {C. Y.} and Ting, {C. W.} and Kao, {Kuo Shu} and Chen, {Ming Yao} and Jimmy Tsang and Yang, {Sheng Shu} and An, {Cho Chyun} and Chang, {Shyh Ming}",

year = "2007",

doi = "10.1109/IMPACT.2007.4433578",

language = "英语",

isbn = "9781424416370",

series = "Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT",

pages = "106--109",

booktitle = "Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT",

note = "2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT ; Conference date: 01-10-2007 Through 03-10-2007",

}

Tsai, MY, Huang, CY, Ting, CW, Kao, KS, Chen, MY, Tsang, J, Yang, SS, An, CC & Chang, SM 2007, Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. in Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT., 4433578, Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, pp. 106-109, 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, Taipei, Taiwan, 01/10/07. https://doi.org/10.1109/IMPACT.2007.4433578

Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. / Tsai, M. Y.; Huang, C. Y.; Ting, C. W. et al.
Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. 2007. p. 106-109 4433578 (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Tsai, M. Y.

AU - Huang, C. Y.

AU - Ting, C. W.

AU - Kao, Kuo Shu

AU - Chen, Ming Yao

AU - Tsang, Jimmy

AU - Yang, Sheng Shu

AU - An, Cho Chyun

AU - Chang, Shyh Ming

PY - 2007

Y1 - 2007

N2 - The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony ) in TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

AB - The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony ) in TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

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BT - Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

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ER -

Tsai MY, Huang CY, Ting CW, Kao KS, Chen MY, Tsang J et al. Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. In Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. 2007. p. 106-109. 4433578. (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT). doi: 10.1109/IMPACT.2007.4433578

Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

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