Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

M. Y. Tsai; C. Y. Huang; C. W. Ting; Kuo Shu Kao; Ming Yao Chen; Jimmy Tsang; Sheng Shu Yang; Cho Chyun An; Shyh Ming Chang

doi:10.1109/IMPACT.2007.4433578

Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

M. Y. Tsai
, C. Y. Huang
, C. W. Ting
, Kuo Shu Kao
, Ming Yao Chen
, Jimmy Tsang
, Sheng Shu Yang
, Cho Chyun An
, Shyh Ming Chang

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony ) in TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

Original language	English
Title of host publication	Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
Pages	106-109
Number of pages	4
DOIs	https://doi.org/10.1109/IMPACT.2007.4433578
State	Published - 2007
Event	2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT - Taipei, Taiwan Duration: 01 10 2007 → 03 10 2007

Publication series

Name	Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Conference

Conference	2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
Country/Territory	Taiwan
City	Taipei
Period	01/10/07 → 03/10/07

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Access to Document

10.1109/IMPACT.2007.4433578

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Tsai, M. Y., Huang, C. Y., Ting, C. W., Kao, K. S., Chen, M. Y., Tsang, J., Yang, S. S., An, C. C., & Chang, S. M. (2007). Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. In Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT (pp. 106-109). Article 4433578 (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2007.4433578

Tsai, M. Y. ; Huang, C. Y. ; Ting, C. W. et al. / Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. 2007. pp. 106-109 (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT).

@inproceedings{6f297da95f764454a2fd92fdf16995a4,

title = "Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads",

abstract = "The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony ) in TFT-LCD after bonding fabrication, thermal shock and 85°C/85\%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.",

author = "Tsai, \{M. Y.\} and Huang, \{C. Y.\} and Ting, \{C. W.\} and Kao, \{Kuo Shu\} and Chen, \{Ming Yao\} and Jimmy Tsang and Yang, \{Sheng Shu\} and An, \{Cho Chyun\} and Chang, \{Shyh Ming\}",

year = "2007",

doi = "10.1109/IMPACT.2007.4433578",

language = "英语",

isbn = "9781424416370",

series = "Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT",

pages = "106--109",

booktitle = "Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT",

note = "2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT ; Conference date: 01-10-2007 Through 03-10-2007",

}

Tsai, MY, Huang, CY, Ting, CW, Kao, KS, Chen, MY, Tsang, J, Yang, SS, An, CC & Chang, SM 2007, Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. in Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT., 4433578, Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, pp. 106-109, 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, Taipei, Taiwan, 01/10/07. https://doi.org/10.1109/IMPACT.2007.4433578

Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. / Tsai, M. Y.; Huang, C. Y.; Ting, C. W. et al.
Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. 2007. p. 106-109 4433578 (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

AU - Tsai, M. Y.

AU - Huang, C. Y.

AU - Ting, C. W.

AU - Kao, Kuo Shu

AU - Chen, Ming Yao

AU - Tsang, Jimmy

AU - Yang, Sheng Shu

AU - An, Cho Chyun

AU - Chang, Shyh Ming

PY - 2007

Y1 - 2007

N2 - The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony ) in TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

AB - The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony ) in TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

UR - https://www.scopus.com/pages/publications/48649105508

U2 - 10.1109/IMPACT.2007.4433578

DO - 10.1109/IMPACT.2007.4433578

M3 - 会议稿件

AN - SCOPUS:48649105508

SN - 9781424416370

T3 - Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

SP - 106

EP - 109

BT - Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

T2 - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Y2 - 1 October 2007 through 3 October 2007

ER -

Tsai MY, Huang CY, Ting CW, Kao KS, Chen MY, Tsang J et al. Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads. In Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. 2007. p. 106-109. 4433578. (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT). doi: 10.1109/IMPACT.2007.4433578

Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

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