Welcome message from Ming-Yi Tsai, conference co-chair

Ming Yi Tsai

doi:10.1109/IMPACT.2018.8625751

Welcome message from Ming-Yi Tsai, conference co-chair

Ming Yi Tsai^*

^*Corresponding author for this work

Department of Mechanical Engineering

IMAPS

Research output: Contribution to journal › Journal Editorial

Original language	English
Article number	8625751
Pages (from-to)	7
Number of pages	1
Journal	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume	2018-October
DOIs	https://doi.org/10.1109/IMPACT.2018.8625751
State	Published - 02 07 2018
Event	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan Duration: 24 10 2018 → 26 10 2018

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10.1109/IMPACT.2018.8625751

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title = "Welcome message from Ming-Yi Tsai, conference co-chair",

author = "Tsai, {Ming Yi}",

year = "2018",

month = jul,

day = "2",

doi = "10.1109/IMPACT.2018.8625751",

language = "英语",

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journal = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",

issn = "2150-5934",

note = "13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 ; Conference date: 24-10-2018 Through 26-10-2018",

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JF - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

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T2 - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018

Y2 - 24 October 2018 through 26 October 2018

ER -

Welcome message from Ming-Yi Tsai, conference co-chair

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