Welcome Message from Ming-Yi Tsai, Conference General Chair

Ming Yi Tsai

doi:10.1109/IMPACT50485.2020.9268604

Welcome Message from Ming-Yi Tsai, Conference General Chair

Ming Yi Tsai^*

^*Corresponding author for this work

Department of Mechanical Engineering

Research output: Contribution to journal › Journal Editorial

Original language	English
Article number	9268604
Pages (from-to)	4
Number of pages	1
Journal	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume	2020-October
DOIs	https://doi.org/10.1109/IMPACT50485.2020.9268604
State	Published - 21 10 2020
Event	15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Taipei, Taiwan Duration: 21 10 2020 → 23 10 2020

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10.1109/IMPACT50485.2020.9268604

Cite this

@article{b2d722f853474f8eb90b75ada0614348,

title = "Welcome Message from Ming-Yi Tsai, Conference General Chair",

author = "Tsai, \{Ming Yi\}",

year = "2020",

month = oct,

day = "21",

doi = "10.1109/IMPACT50485.2020.9268604",

language = "英语",

volume = "2020-October",

pages = "4",

journal = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",

issn = "2150-5934",

publisher = "IEEE Computer Society",

note = "15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 ; Conference date: 21-10-2020 Through 23-10-2020",

}

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T1 - Welcome Message from Ming-Yi Tsai, Conference General Chair

AU - Tsai, Ming Yi

PY - 2020/10/21

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U2 - 10.1109/IMPACT50485.2020.9268604

DO - 10.1109/IMPACT50485.2020.9268604

M3 - 社论

AN - SCOPUS:85098216655

SN - 2150-5934

VL - 2020-October

SP - 4

JO - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

JF - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

M1 - 9268604

T2 - 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020

Y2 - 21 October 2020 through 23 October 2020

ER -

Welcome Message from Ming-Yi Tsai, Conference General Chair

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