每年研究計畫-專案
個人檔案
教授課程
工程數學(1)
人工智慧概論
程式設計
工程數學(3)
程式設計
人工智慧概論
程式設計
工程數學(3)
程式設計
學歷
博士, 劍橋大學,英國
1991.0-1995.0
1991.0-1995.0
Keywords
- 微奈米接觸力學
- 表面量測
- 碎形理論
- 隨機振動
指紋
查看啟用 Jiunn-Jong Wu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 相近領域學者
過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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Adhesive contact between a rigid toroidal indenter and an elastic half-space
Wu, J. J., 03 2024, 於: Journal of Adhesion Science and Technology. 38研究成果: 期刊稿件 › 文章 › 同行評審
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Boundary element analyses on the adhesive contact between a rigid cylinder and an elastic layer bonded on a rigid half-space
Wu, J. J., 2023, 於: Journal of Adhesion Science and Technology. 37, 10, p. 1683-1711 29 p.研究成果: 期刊稿件 › 文章 › 同行評審
1 引文 斯高帕斯（Scopus） -
出席2023年福岡國際磨潤會議 (International Tribology Conference 2023, Fukuoka)報告
Wu, J.-J., 2023.研究成果: 會議稿件的類型 › 出席國際會議報告
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Numerical analysis on the adhesive contact between a rigid power-law shaped axisymmetric asperity and an elastic half-space
Wu, J. J., 2022, 於: Journal of Adhesion Science and Technology. 36, 2, p. 195-219 25 p.研究成果: 期刊稿件 › 文章 › 同行評審
4 引文 斯高帕斯（Scopus） -
獎項
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2023年全球前2%頂尖科學家-年度科學影響力
Tiao, M.-M. (Recipient), Yu, H.-R. (Recipient), Fang, J.-Y. (Recipient), Wang, C.-Y. (Recipient), Wang, J.-S. (Recipient), Yu, J.-S. (Recipient), Wu, C.-P. (Recipient), Wu, M.-H. (Recipient), Wu, J.-J. (Recipient), Wu, C.-Y. (Recipient), Lee, C.-H. (Recipient), Lei, K.-F. (Recipient), Sahoo, P. K. (Recipient), Lin, S.-W. (Recipient), Lin, W.-C. (Recipient), Chiu, F.-C. (Recipient), Shih, S.-R. (Recipient), Ke, P.-Y. (Recipient), Chi, C.-C. (Recipient), Tang, S.-T. (Recipient), Fu, H.-J. (Recipient), Shyu, Y.-I. L. (Recipient), Martel, J. (Recipient), Tsui, P.-H. (Recipient), Chang, C.-C. (Recipient), Chang, H.-T. (Recipient), Chang, C.-T. (Recipient), Juang, R.-S. (Recipient), Kuo, H.-C. (Recipient), Kuo, C.-F. (Recipient), Chen, J.-P. (Recipient), Chen, C.-H. (Recipient), Tan, C.-M. (Recipient), Chen, T.-Y. (Recipient), Chen, N.-H. (Recipient), Yang, C.-W. (Recipient), Yeh, C.-T. (Recipient), Liou, E.J.-W. (Recipient), Liu, S.-J. (Recipient), Pan, T.-M. (Recipient), Tsai, M.-H. (Recipient), Tsai, Y.-F. (Recipient), Teng, C.-I. (Recipient), Shiau, W.-L. (Recipient), Hsiao, C.-Y. (Recipient), Lai, J.-Y. (Recipient), Lou, B.-S. (Recipient) & Lo, L.-J. (Recipient), 2023
獎項: 全球前2%頂尖科學家 › 全球前2%頂尖科學家-年度科學影響力
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2023年全球前2%頂尖科學家-終身科學影響力
Fang, J.-Y. (Recipient), Wang, J.-S. (Recipient), Wu, M.-H. (Recipient), Wu, J.-J. (Recipient), Lee, K.-M. (Recipient), Lei, K.-F. (Recipient), Sahoo, P. K. (Recipient), Lin, K.-J. (Recipient), Lin, S.-W. (Recipient), Chiu, F.-C. (Recipient), Tang, S.-T. (Recipient), Shyu, Y.-I. L. (Recipient), Tsui, P.-H. (Recipient), Chang, H.-T. (Recipient), Chang, C.-T. (Recipient), Juang, R.-S. (Recipient), Hsu, C.-L. (Recipient), Sheu, B. J. (Recipient), Kuo, J.-T. (Recipient), Kuo, H.-C. (Recipient), Chen, J.-P. (Recipient), Tan, C.-M. (Recipient), Chen, T.-Y. (Recipient), Chen, M.-L. (Recipient), Yang, C.-W. (Recipient), Yeh, C.-T. (Recipient), Liou, E.J.-W. (Recipient), Liu, S.-J. (Recipient), Pan, T.-M. (Recipient), Tsai, Y.-F. (Recipient), Teng, C.-I. (Recipient), Lai, J.-Y. (Recipient) & Lo, L.-J. (Recipient), 2023
獎項: 全球前2%頂尖科學家 › 全球前2%頂尖科學家-終身科學影響力