出席「2016 International Conference on Solid State Devices and Materials (2016SSDM )(2016固態元件與材料國際研討會)」報告

Ming-Chung Wu

出席「2016 International Conference on Solid State Devices and Materials (2016SSDM )(2016固態元件與材料國際研討會)」報告

化工與材料工程學系(含學碩博士班及碩士在職專班)

研究成果: 會議稿件的類型 › 出席國際會議報告

原文	繁體中文
出版狀態	已出版 - 2016
事件	2016 International Conference on Solid State Devices and Materials (2016SSDM )(2016固態元件與材料國際研討會) - Tsukuba, Japan 持續時間: 26 09 2016 → 29 09 2016

Conference

Conference	2016 International Conference on Solid State Devices and Materials (2016SSDM )(2016固態元件與材料國際研討會)
期間	26/09/16 → 29/09/16

引用此

@conference{9160c144592d48d78da6d3835f77ac95,

title = "出席「2016 International Conference on Solid State Devices and Materials (2016SSDM )(2016固態元件與材料國際研討會)」報告",

author = "Ming-Chung Wu",

year = "2016",

language = "繁體中文",

note = "2016 International Conference on Solid State Devices and Materials (2016SSDM )(2016固態元件與材料國際研討會) ; Conference date: 26-09-2016 Through 29-09-2016",

}

TY - CONF

T1 - 出席「2016 International Conference on Solid State Devices and Materials (2016SSDM )(2016固態元件與材料國際研討會)」報告

AU - Wu, Ming-Chung

PY - 2016

Y1 - 2016

M3 - 出席國際會議報告

T2 - 2016 International Conference on Solid State Devices and Materials (2016SSDM )(2016固態元件與材料國際研討會)

Y2 - 26 September 2016 through 29 September 2016

ER -