出席「The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)」會議報告

Kin-Fong Lei

出席「The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)」會議報告

Kin-Fong Lei

奈米工程及設計碩士學位學程

研究成果: 會議稿件的類型 › 出席國際會議報告

原文	繁體中文
出版狀態	已出版 - 2023
事件	The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023) - Sydney, Australia 持續時間: 24 07 2023 → 27 07 2023

Conference

Conference	The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)
期間	24/07/23 → 27/07/23

The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)
Lei, K.-F. (參加者)
23 07 2023 → 27 07 2023
活動: Participating in a conference, workshop, ...

引用此

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title = "出席「The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)」會議報告",

author = "Kin-Fong Lei",

year = "2023",

language = "繁體中文",

note = "The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023) ; Conference date: 24-07-2023 Through 27-07-2023",

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T1 - 出席「The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)」會議報告

AU - Lei, Kin-Fong

PY - 2023

Y1 - 2023

M3 - 出席國際會議報告

T2 - The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)

Y2 - 24 July 2023 through 27 July 2023

ER -

出席「The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)」會議報告

Conference

活動

The 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE-EMBC 2023)

引用此