A Energy-Efficient Re-configurable Multi-mode Convolution Neuron Network Accelerator

Huan Ke Hsu*, I. Chyn Wey, T. Hui Teo

*此作品的通信作者

研究成果: 圖書/報告稿件的類型會議稿件同行評審

摘要

A high-performance re-configurable Convolutional Neural Network (CNN) accelerator with multiple modes is introduced in this paper. The conventional CNN involves extensive computations, but this paper presents the Multiple Modes CNN Computation Unit (MMCN), which, in comparison, accomplishes the convolution model without including pooling and dense layers. As presented in this paper, the pooling layer has been replaced with a pooling unit comprising several logic gates, reducing the MMCN's area. Due to the modifications detailed in this paper, the computational path of MMCN is considerably shorter than that of a conventional CNN chip. Therefore, this paper aims to reduce the computation circuit compared to conventional CNN accelerators. Owing to the modifications detailed in this paper, the computational path of MMCN is considerably shorter than that of a conventional CNN chip. The proposed MMCN significantly reduces the circuit area by eliminating redundant circuit components. Finally, the proposed MMCN is evaluated using the VGG-16 model and the CIFAR-10 dataset, with implementation in the TSMC 90-nm CMOS process. This implementation results in an 89% reduction in power consumption, 70% reduction in area, and 62.8% increase in speed, with only 1% accuracy loss.

原文英語
主出版物標題Proceedings - 2023 16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023
發行者Institute of Electrical and Electronics Engineers Inc.
頁面45-50
頁數6
ISBN(電子)9798350393613
DOIs
出版狀態已出版 - 2023
事件16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023 - Singapore, 新加坡
持續時間: 18 12 202321 12 2023

出版系列

名字Proceedings - 2023 16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023

Conference

Conference16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023
國家/地區新加坡
城市Singapore
期間18/12/2321/12/23

文獻附註

Publisher Copyright:
© 2023 IEEE.

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