A Fairness Approach to Mitigating Racial Bias of Credit Scoring Models by Decision Tree and the Reweighing Fairness Algorithm

Jen Ying Shih, Ze Han Chin

研究成果: 圖書/報告稿件的類型會議稿件同行評審

摘要

Credit scoring models have been widely applied by financial institutions, Peer to Peer (P2P) lending service providers, and Buy Now Pay Later (BNPL) service providers to evaluate their customers' financial status. Therefore, it has a large impact on consumer financing activities. However, unfair evaluation may occur as the development of credit scoring models contains biased judgments (e.g., racial bias), which deteriorates users' credit access ability. Thus, we study the feasibility of mitigating racial bias in developing a credit scoring model. By using a data set provided by a P2P lending platform, LendingClub, we integrated the C5.0 decision tree algorithm and the reweighing fairness algorithm to develop credit scoring models with cost-sensitive modeling concepts. Multi-class fair credit scoring evaluation was also studied in terms of performance indices, including accuracy, average cost, and unfairness metrics. The results demonstrated that the reweighing fairness algorithm reduced the unfairness and average cost of models. In addition, combining the fairness algorithm and cost-sensitive modeling minimized the average cost of models while maintaining the functionality of the fairness algorithm.

原文英語
主出版物標題2023 IEEE 3rd International Conference on Electronic Communications, Internet of Things and Big Data, ICEIB 2023
編輯Teen-Hang Meen
發行者Institute of Electrical and Electronics Engineers Inc.
頁面100-105
頁數6
ISBN(電子)9798350333862
DOIs
出版狀態已出版 - 2023
對外發佈
事件3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data, ICEIB 2023 - Taichung, 台灣
持續時間: 14 04 202316 04 2023

出版系列

名字2023 IEEE 3rd International Conference on Electronic Communications, Internet of Things and Big Data, ICEIB 2023

Conference

Conference3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data, ICEIB 2023
國家/地區台灣
城市Taichung
期間14/04/2316/04/23

文獻附註

Publisher Copyright:
© 2023 IEEE.

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