A general procedure for process yield with multiple characteristics

Fu Kwun Wang*

*此作品的通信作者

研究成果: 期刊稿件文章同行評審

16 引文 斯高帕斯(Scopus)

摘要

In this paper, we present a general procedure for evaluating the process yield with multiple characteristics in semiconductor manufacturing processes. The proposed process yield indices can be applied for multivariate normal distribution data or multivariate non-normal distribution data. These indices provide an exact measure of the overall process yield. Also, we show how to calculate the approximate lower confidence bound for the true process yield by using the one-to-one correspondence between the proposed process yield index and the overall process yield. Three examples are used to demonstrate the performance of the proposed approach. The results show that our procedure for evaluating the process yield with multiple characteristics is an effective approach.

原文英語
文章編號4
頁(從 - 到)503-508
頁數6
期刊IEEE Transactions on Semiconductor Manufacturing
23
發行號4
DOIs
出版狀態已出版 - 11 2010
對外發佈

指紋

深入研究「A general procedure for process yield with multiple characteristics」主題。共同形成了獨特的指紋。

引用此