@inproceedings{e2b22dce747b4930a75dded9e0c216ae,
title = "Blech effect in Cu interconnects with oxide and low-k dielectrics",
author = "Yuejin Hou and Tan, \{Cher Ming\}",
year = "2007",
doi = "10.1109/IPFA.2007.4378059",
language = "英语",
isbn = "1424410142",
series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",
pages = "65--69",
booktitle = "Proceedings of the 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2007",
note = "2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ; Conference date: 11-07-2007 Through 13-07-2007",
}