Calculation of sputtering rate by a Monte Carlo method

J. H. Hsieh; C. Li

doi:10.1023/A:1025114725607

Calculation of sputtering rate by a Monte Carlo method

J. H. Hsieh^*
, C. Li

^*此作品的通信作者

Nanyang Technological University

研究成果: 期刊稿件 › 文章 › 同行評審

2 引文斯高帕斯（Scopus）

摘要

The sputtering rate during a plasma-assisted process was calculated. Monte Carlo simulation was used for the calculation. It was observed that sputtering was one of the most important mechanisms occurring on the cathod during a plasma-assisted process.

原文	英語
頁（從 - 到）	1125-1126
頁數	2
期刊	Journal of Materials Science Letters
卷	22
發行號	16
DOIs	https://doi.org/10.1023/A:1025114725607
出版狀態	已出版 - 15 08 2003
對外發佈	是

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abstract = "The sputtering rate during a plasma-assisted process was calculated. Monte Carlo simulation was used for the calculation. It was observed that sputtering was one of the most important mechanisms occurring on the cathod during a plasma-assisted process.",

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AU - Li, C.

PY - 2003/8/15

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N2 - The sputtering rate during a plasma-assisted process was calculated. Monte Carlo simulation was used for the calculation. It was observed that sputtering was one of the most important mechanisms occurring on the cathod during a plasma-assisted process.

AB - The sputtering rate during a plasma-assisted process was calculated. Monte Carlo simulation was used for the calculation. It was observed that sputtering was one of the most important mechanisms occurring on the cathod during a plasma-assisted process.

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DO - 10.1023/A:1025114725607

M3 - 文章

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SP - 1125

EP - 1126

JO - Journal of Materials Science Letters

JF - Journal of Materials Science Letters

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Calculation of sputtering rate by a Monte Carlo method

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