Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification

M. X. Gu*, T. C. Au Yeung, C. M. Tan, V. Nosik

*此作品的通信作者

研究成果: 期刊稿件文章同行評審

5 引文 斯高帕斯(Scopus)

摘要

The impact of bond order loss of surface atoms on thermal conductivity of cylindrical silicon nanowires has been examined using the isotropic elastic continuum model. A core-shell structure with a modified Young's modulus in the surface skin of the wire has been used. Thermal conductivity is calculated from modified phonon dispersion relations based on recent developed bond-order-length-strength (BOLS) correlation. This work extends the previous linear approximation [Yeung Phys. Rev. B 74, 155317 (2006)] to calculate the phonon dispersion relation of torsional mode and longitudinal mode using the nonlinear approach. A significant increase in thermal conductivity is found compared to the case without using BOLS correlation.

原文英語
文章編號094304
期刊Journal of Applied Physics
100
發行號9
DOIs
出版狀態已出版 - 2006
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