Classification of autoclave temperature via deep learning

Wan Ju Lin, Jian Wen Chen, Che Lun Hung, Ching Hsien Hsu

研究成果: 圖書/報告稿件的類型會議稿件同行評審

2 引文 斯高帕斯(Scopus)

摘要

In the composite material processing, autoclave forming is a commonly-used approach by the action of heat and pressure at the same time. The temperature distribution could greatly affect the quality of composite material. However, high temperature and cacuum leakage could result in poor quality of composite products. It is important to discover the reasons that caused undesirable composite product during the processing. In recent years, deep learning technique has achieved great success in improving manufacturing processing. In this paper, we applied CNN and long short term memory (LSTM) models for analysis the processing temperature types of the composite materials. In this study, we have made a comparative analysis of two different classification algorithms with 8 categories autoclave. The results show that CNN model was able to correctly recognize eight types of the autoclave in 83.33%, and 72.22% accuracy of LSTM model. With this intelligence models, which make it possible to perform in the autoclave forming processing to trace out the types of composite processing temperature.

原文英語
主出版物標題Proceedings - 2019 IEEE International Conferences on Ubiquitous Computing and Communications and Data Science and Computational Intelligence and Smart Computing, Networking and Services, IUCC/DSCI/SmartCNS 2019
發行者Institute of Electrical and Electronics Engineers Inc.
頁面653-656
頁數4
ISBN(電子)9781728152097
DOIs
出版狀態已出版 - 10 2019
對外發佈
事件2019 IEEE International Conferences on Ubiquitous Computing and Communications and Data Science and Computational Intelligence and Smart Computing, Networking and Services, IUCC/DSCI/SmartCNS 2019 - Shenyang, 中國
持續時間: 21 10 201923 10 2019

出版系列

名字Proceedings - 2019 IEEE International Conferences on Ubiquitous Computing and Communications and Data Science and Computational Intelligence and Smart Computing, Networking and Services, IUCC/DSCI/SmartCNS 2019

Conference

Conference2019 IEEE International Conferences on Ubiquitous Computing and Communications and Data Science and Computational Intelligence and Smart Computing, Networking and Services, IUCC/DSCI/SmartCNS 2019
國家/地區中國
城市Shenyang
期間21/10/1923/10/19

文獻附註

Publisher Copyright:
© 2019 IEEE.

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