Computer-aided design on the VLSI 45 C- mask compaction

W. S. Feng; W. T. Yang; M. Y. Hsieh

Computer-aided design on the VLSI 45 C- mask compaction

W. S. Feng^*, W. T. Yang, M. Y. Hsieh

^*此作品的通信作者

National Taiwan University

研究成果: 圖書/報告稿件的類型 › 會議稿件 › 同行評審

1 引文斯高帕斯（Scopus）

摘要

In this paper, we combine 1-D compaction with reshaping -a new action, to improve the result of compaction. Our algorithms change layout elements' shapes automatically according to some criteria and make neighboring layout elements' shapes as similar as possible. The more similar they are, the more compactable space we can obtain. The main part of our compaction is reshaping. If elements of certain 45 degrees layout can be reassigned their geometric shapes, we reshape them in order to gain more compactable space. Some experimental results of this 45 degree compactor with and without reshaping of both Manhattan and nonManhattan-45 degree layouts are shown.

原文	英語
主出版物標題	Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)
編輯	Anon
發行者	Publ by IEEE
頁面	750-753
頁數	4
ISBN（列印）	0780312333
出版狀態	已出版 - 1993
對外發佈	是
事件	Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5) - Beijing, China 持續時間: 19 10 1993 → 21 10 1993

出版系列

名字	Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)

Conference

Conference	Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5)
城市	Beijing, China
期間	19/10/93 → 21/10/93

其它文件與鏈接

Link to publication in Scopus

引用此

@inproceedings{c0869978da1f45a4a9277b9b98910bbc,

title = "Computer-aided design on the VLSI 45 C- mask compaction",

abstract = "In this paper, we combine 1-D compaction with reshaping -a new action, to improve the result of compaction. Our algorithms change layout elements' shapes automatically according to some criteria and make neighboring layout elements' shapes as similar as possible. The more similar they are, the more compactable space we can obtain. The main part of our compaction is reshaping. If elements of certain 45 degrees layout can be reassigned their geometric shapes, we reshape them in order to gain more compactable space. Some experimental results of this 45 degree compactor with and without reshaping of both Manhattan and nonManhattan-45 degree layouts are shown.",

author = "Feng, {W. S.} and Yang, {W. T.} and Hsieh, {M. Y.}",

year = "1993",

language = "英语",

isbn = "0780312333",

series = "Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)",

publisher = "Publ by IEEE",

pages = "750--753",

editor = "Anon",

booktitle = "Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)",

note = "Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5) ; Conference date: 19-10-1993 Through 21-10-1993",

}

Feng, WS, Yang, WT & Hsieh, MY 1993, Computer-aided design on the VLSI 45 C- mask compaction. 於 Anon (編輯), Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93). Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93), Publ by IEEE, 頁 750-753, Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5), Beijing, China, 19/10/93.

TY - GEN

T1 - Computer-aided design on the VLSI 45 C- mask compaction

AU - Feng, W. S.

AU - Yang, W. T.

AU - Hsieh, M. Y.

PY - 1993

Y1 - 1993

N2 - In this paper, we combine 1-D compaction with reshaping -a new action, to improve the result of compaction. Our algorithms change layout elements' shapes automatically according to some criteria and make neighboring layout elements' shapes as similar as possible. The more similar they are, the more compactable space we can obtain. The main part of our compaction is reshaping. If elements of certain 45 degrees layout can be reassigned their geometric shapes, we reshape them in order to gain more compactable space. Some experimental results of this 45 degree compactor with and without reshaping of both Manhattan and nonManhattan-45 degree layouts are shown.

AB - In this paper, we combine 1-D compaction with reshaping -a new action, to improve the result of compaction. Our algorithms change layout elements' shapes automatically according to some criteria and make neighboring layout elements' shapes as similar as possible. The more similar they are, the more compactable space we can obtain. The main part of our compaction is reshaping. If elements of certain 45 degrees layout can be reassigned their geometric shapes, we reshape them in order to gain more compactable space. Some experimental results of this 45 degree compactor with and without reshaping of both Manhattan and nonManhattan-45 degree layouts are shown.

UR - http://www.scopus.com/inward/record.url?scp=0027758450&partnerID=8YFLogxK

M3 - 会议稿件

AN - SCOPUS:0027758450

SN - 0780312333

T3 - Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)

SP - 750

EP - 753

BT - Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)

A2 - Anon, null

PB - Publ by IEEE

T2 - Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5)

Y2 - 19 October 1993 through 21 October 1993

ER -

Computer-aided design on the VLSI 45 C- mask compaction

摘要

出版系列

Conference

其它文件與鏈接

指紋

引用此