Copper electrodeposition on a magnesium alloy (AZ80) with a U-shaped surface

Ching An Huang*, Yu Hu Yeh, Che Kuan Lin, Chen Yun Hsieh

*此作品的通信作者

研究成果: 期刊稿件文章同行評審

2 引文 斯高帕斯(Scopus)

摘要

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating.

原文英語
頁(從 - 到)7366-7378
頁數13
期刊Materials
7
發行號11
DOIs
出版狀態已出版 - 2014

文獻附註

Publisher Copyright:
© 2014 by the authors.

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