摘要
An electroplating process was proposed for obtaining a protective Cr/Cu deposit on the two-phase Mg alloy AZ91D. The corrosion behavior of Cu-covered and Cr/Cu-covered AZ91D specimens was studied electrochemically in 0.1 M H2SO4 with different NaCl concentrations. Experimental results showed that the corrosion resistance of an AZ91D specimen improved significantly after Cr/Cu electrodeposition. The corrosion resistance of Cr/Cu-covered AZ91D decreased with increasing NaCl concentration in 0.1 M H2SO4 solution. After immersion in a 0.1 M H2SO4 with a NaCl-content above 3.5 wt.%, the surface of Cr/Cu-covered AZ91D suffered a few blisters. Cracks through the Cr deposit provided active pathways for corrosion of the Cu and the AZ91D substrate. Formation of blisters on the Cr/Cu-covered AZ91D surface was confirmed based on the results of an open-circuit potential test, which detected an obvious potential drop from noble to active potentials.
| 原文 | 英語 |
|---|---|
| 頁(從 - 到) | 1326-1332 |
| 頁數 | 7 |
| 期刊 | Corrosion Science |
| 卷 | 52 |
| 發行號 | 4 |
| DOIs | |
| 出版狀態 | 已出版 - 04 2010 |
指紋
深入研究「Corrosion behavior of Cr/Cu-coated Mg alloy (AZ91D) in 0.1 M H2SO4 with different concentrations of NaCl」主題。共同形成了獨特的指紋。引用此
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver