跳至主導覽 跳至搜尋 跳過主要內容

Current path analysis for electrostatic discharge protection

  • Hung Yi Liu*
  • , Chung Wei Lin
  • , Szu Jui Chou
  • , Wei Ting Tu
  • , Chih Hung Liu
  • , Yao Wen Chang
  • , Sy Yen Kuo
  • *此作品的通信作者
  • National Taiwan University

研究成果: 圖書/報告稿件的類型會議稿件同行評審

8 引文 斯高帕斯(Scopus)

摘要

The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer circuit design. High voltages resulted from ESD might cause high current densities in a small device and burn it out, so on-chip protection circuits for IC pads are required. To reduce the design cost, the protection circuit should be added only for the IC pads with an ESD current path, which arises the ESD current path analysis problem. In this paper, we first introduce the analysis problem for ESD protection in circuit design. We then model the circuit as a constrained graph, decompose ESD connected components linked with the pads, and apply the breadth-first search (BFS) to identify the ESD connected components in each constrained graph and thus the current paths. Experimental results show that our algorithm can detect all ESD paths very efficiently and economically. To our best knowledge, our algorithm is the first point tool available to the public for the ESD analysis.

原文英語
主出版物標題Proceedings of the 2006 International Conference on Computer-Aided Design, ICCAD
頁面510-515
頁數6
DOIs
出版狀態已出版 - 2006
對外發佈
事件2006 International Conference on Computer-Aided Design, ICCAD - San Jose, CA, 美國
持續時間: 05 11 200609 11 2006

出版系列

名字IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN(列印)1092-3152

Conference

Conference2006 International Conference on Computer-Aided Design, ICCAD
國家/地區美國
城市San Jose, CA
期間05/11/0609/11/06

指紋

深入研究「Current path analysis for electrostatic discharge protection」主題。共同形成了獨特的指紋。

引用此