Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes

Earth and Planetary Sciences

• Array 100%
• Ball 100%
• Strain 100%
• Plastic 100%
• Specimen 50%
• Substrate 40%
• Warpage 30%
• Temperature 20%
• Heating 20%
• Deformation 20%
• Package 20%
• Cooling 20%
• Curing 20%
• Experiment 10%
• Investigation 10%
• Coefficient 10%
• Surface Pressure 10%
• Condition 10%
• Silicon 10%
• Shape 10%
• Shrinkage 10%
• Value 10%
• Purpose 10%
• Real Time 10%
• Microprocessor 10%
• Cycle 10%
• Lead 10%
• Plane 10%
• Manufacturing 10%
• Mechanics 10%
• Modulus of Elasticity 10%
• Room Temperature 10%
• Thermal Expansion 10%
• Glass Transition Temperature 10%

Engineering

• Molding 100%
• Residual Strain 100%
• Ball Grid Arrays 100%
• Substrates 40%
• Temperature 20%
• Heating 20%
• Fields 20%
• Experiments 10%
• Gas Fuel Manufacture 10%
• Room Temperature 10%
• Young's Modulus 10%
• Induced Deformation 10%
• Plane Deformation 10%
• Numerical Approach 10%
• Coefficient of Thermal Expansion 10%
• Chemical Shrinkage 10%
• Lead-Free Solder 10%
• Cooling Condition 10%
• Glass Transition Temperature (Tg) 10%
• Flow Pressure 10%
• Finite Element Method 10%

Material Science

• Strain 100%
• Plastics 100%
• Sheet Molding Compounds 100%
• Temperature 30%
• Silicon 10%
• Material 10%
• Finite Element Methods 10%
• Shrinkage 10%
• Elastic Moduli 10%
• Glass Transition Temperature 10%
• Thermal Cycling 10%
• Thermal Expansion 10%
• Lead-Free Solder 10%
• Cooling 10%