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Device stress evaluation of InAs/AlSb HEMT on silicon substrate with refractory iridium Schottky gate metal

  • Hsien Chin Chiu*
  • , Wen Yu Lin
  • , Chia Yi Chou
  • , Shih Hsien Yang
  • , Kai Di Mai
  • , Pei Chin Chiu
  • , W. J. Hsueh
  • , Jen Inn Chyi
  • *此作品的通信作者
  • Chang Gung University
  • National Central University

研究成果: 期刊稿件 › 文章 › 同行評審

5 引文 斯高帕斯(Scopus)

摘要

In this work, the 6-inch AlSb/InAs on Si (0 0 1) substrate is used to increase device integration and cost-effective purpose. The iridium (Ir)-gate was used for the InAs/AlSb on silicon substrate and temperature-dependent characteristics were also studied. The Ir-gate exhibited a superior metal work function which was beneficial for increasing the Schottky barrier height of InAs/AlSb on silicon heterostructures. Moreover, transmission electron microscopy, secondary ion mass spectrometry, and low frequency noise measurements were conducted to proof that the Ir-gated AlSb/InAs HEMT achieved the better stability of characteristics after self-heating and hot-carrier stresses.

原文英語
頁(從 - 到)17-20
頁數4
期刊Microelectronic Engineering
卷138
DOIs
出版狀態已出版 - 20 04 2015

文獻附註

Publisher Copyright:
© 2015 Elsevier B.V. All rights reserved.

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