@inproceedings{ec87fa673136427fb00f490b44c8f392,
title = "Electrocrystallization behavior of copper electrodeposited from aqueous sulfuric acid with thiourea and chloride additives",
abstract = "Copper was electroplated from cupric sulfate-sulfuric acid solutions with various concentrations of thiourea and chloride ions. The microstructures of deposits were analyzed by optical microscopy, X-ray diffraction (XRD) and transmission electron microscopy (TEM). XRD results indicated that the most preferred orientation of the copper deposits was (220) when thiourea concentrations were greater than 5 ppm. However, the preferred orientation changed obviously when chloride ions were added together with thiourea;, moreover, the grain type of the deposit changed from columnar to equiaxed. TEM images showed considerable twinning in copper plated from solutions containing less than 1 ppm thiourea. Grain sizes of copper deposits decreased when higher concentrations of thiourea were added to the plating bath, together with chloride ions. Copyright The Electrochemical Society.",
author = "Chang, \{J. H.\} and Huang, \{C. A.\} and Hsu, \{F. Y.\}",
year = "2006",
language = "英语",
isbn = "1566774403",
series = "ECS Transactions",
publisher = "Electrochemical Society Inc.",
number = "3",
pages = "329--334",
booktitle = "Electrochemistry in Mineral and Metal Processing VII",
edition = "3",
note = "7th International Symposium on Electrochemistry in Mineral and Metal Processing - 209th Meeting of the Electrochemical Society ; Conference date: 08-05-2006 Through 10-05-2006",
}