Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)

C. A. Huang*, T. H. Wang, T. Weirich, V. Neubert

*此作品的通信作者

研究成果: 期刊稿件文章同行評審

60 引文 斯高帕斯(Scopus)

摘要

An environmental-friendly Cu electrodeposition process was proposed for the Magnesium alloy (AZ 31). Experimental results show that a good bonding between Cu deposit and Mg alloy surface can be achieved with a pretreatment of galvanostatic etching and then copper electrodeposition in the alkaline copper-sulfate plating bath. Microstructures between Cu deposit and Mg alloy substrate were examined with scanning electron and energy-filtering transmission electron microscopes (SEM and EF-TEM). The Cu-deposited Mg alloy can be further electroplated in acidic Cu and Ni plating baths to acquire a protective Cu/Ni deposit.

原文英語
頁(從 - 到)1385-1390
頁數6
期刊Corrosion Science
50
發行號5
DOIs
出版狀態已出版 - 05 2008

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