Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)

An environmental-friendly Cu electrodeposition process was proposed for the Magnesium alloy (AZ 31). Experimental results show that a good bonding between Cu deposit and Mg alloy surface can be achieved with a pretreatment of galvanostatic etching and then copper electrodeposition in the alkaline copper-sulfate plating bath. Microstructures between Cu deposit and Mg alloy substrate were examined with scanning electron and energy-filtering transmission electron microscopes (SEM and EF-TEM). The Cu-deposited Mg alloy can be further electroplated in acidic Cu and Ni plating baths to acquire a protective Cu/Ni deposit.