摘要
In this paper, we use the hierarchical placement algorithm to implement the EMC-driven MCM placement. To ensure that every maximal connection chip pairs would be placed as close as possible, we provide an clustering development algorithm. A proper model for EMC-driven MCM placement is used in this work. By this model, we use the short wire antenna to simulate the radiation of each chip on the substrate. At present, we have implemented an MCM placement program successfully, and this program can output the layout with the CIF form.
| 原文 | 英語 |
|---|---|
| 頁（從 - 到） | 364-367 |
| 頁數 | 4 |
| 期刊 | IEEE International Symposium on Electromagnetic Compatibility |
| 出版狀態 | 已出版 - 1997 |
| 對外發佈 | 是 |
| 事件 | Proceedings of the 1997 International Symposium on Electromagnetic Compatibility, EMC - Beijing, China 持續時間: 21 05 1997 → 23 05 1997 |