EMC-driven placement for MCM

Wu shiung Feng; Yaw hua Tseng

EMC-driven placement for MCM

Wu shiung Feng^*
, Yaw hua Tseng

^*此作品的通信作者

National Taiwan University

研究成果: 期刊稿件 › 會議文章 › 同行評審

1 引文斯高帕斯（Scopus）

摘要

In this paper, we use the hierarchical placement algorithm to implement the EMC-driven MCM placement. To ensure that every maximal connection chip pairs would be placed as close as possible, we provide an clustering development algorithm. A proper model for EMC-driven MCM placement is used in this work. By this model, we use the short wire antenna to simulate the radiation of each chip on the substrate. At present, we have implemented an MCM placement program successfully, and this program can output the layout with the CIF form.

原文	英語
頁（從 - 到）	364-367
頁數	4
期刊	IEEE International Symposium on Electromagnetic Compatibility
出版狀態	已出版 - 1997
對外發佈	是
事件	Proceedings of the 1997 International Symposium on Electromagnetic Compatibility, EMC - Beijing, China 持續時間: 21 05 1997 → 23 05 1997

其它文件與鏈接

Link to publication in Scopus

引用此

@article{96e9b0c280f54c29bbc4963a1747fc64,

title = "EMC-driven placement for MCM",

abstract = "In this paper, we use the hierarchical placement algorithm to implement the EMC-driven MCM placement. To ensure that every maximal connection chip pairs would be placed as close as possible, we provide an clustering development algorithm. A proper model for EMC-driven MCM placement is used in this work. By this model, we use the short wire antenna to simulate the radiation of each chip on the substrate. At present, we have implemented an MCM placement program successfully, and this program can output the layout with the CIF form.",

author = "Feng, \{Wu shiung\} and Tseng, \{Yaw hua\}",

year = "1997",

language = "英语",

pages = "364--367",

journal = "IEEE International Symposium on Electromagnetic Compatibility",

issn = "0190-1494",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1997 International Symposium on Electromagnetic Compatibility, EMC ; Conference date: 21-05-1997 Through 23-05-1997",

}

TY - JOUR

T1 - EMC-driven placement for MCM

AU - Feng, Wu shiung

AU - Tseng, Yaw hua

PY - 1997

Y1 - 1997

N2 - In this paper, we use the hierarchical placement algorithm to implement the EMC-driven MCM placement. To ensure that every maximal connection chip pairs would be placed as close as possible, we provide an clustering development algorithm. A proper model for EMC-driven MCM placement is used in this work. By this model, we use the short wire antenna to simulate the radiation of each chip on the substrate. At present, we have implemented an MCM placement program successfully, and this program can output the layout with the CIF form.

AB - In this paper, we use the hierarchical placement algorithm to implement the EMC-driven MCM placement. To ensure that every maximal connection chip pairs would be placed as close as possible, we provide an clustering development algorithm. A proper model for EMC-driven MCM placement is used in this work. By this model, we use the short wire antenna to simulate the radiation of each chip on the substrate. At present, we have implemented an MCM placement program successfully, and this program can output the layout with the CIF form.

UR - https://www.scopus.com/pages/publications/0030676829

M3 - 会议文章

AN - SCOPUS:0030676829

SN - 0190-1494

SP - 364

EP - 367

JO - IEEE International Symposium on Electromagnetic Compatibility

JF - IEEE International Symposium on Electromagnetic Compatibility

T2 - Proceedings of the 1997 International Symposium on Electromagnetic Compatibility, EMC

Y2 - 21 May 1997 through 23 May 1997

ER -

EMC-driven placement for MCM

摘要

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