Epoxy Molding Compound Lead Frames with Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes

Tsung Yen Liu, Shih Ming Huang, Mu Jen Lai, Rui Sen Liu, Yi Tsung Chang, Wen Hong Sun, Ray Ming Lin*

*此作品的通信作者

研究成果: 期刊稿件文章同行評審

4 引文 斯高帕斯(Scopus)

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Material Science

Engineering