Experimental study of evaporation resistance on porous surfaces in flat heat pipes

Liang Han Chien; C. C. Chang

doi:10.1109/ITHERM.2002.1012463

Experimental study of evaporation resistance on porous surfaces in flat heat pipes

Liang Han Chien, C. C. Chang

機械工程學系(含學碩博士班)

Chang Gung University

研究成果: 圖書/報告稿件的類型 › 會議稿件 › 同行評審

13 引文斯高帕斯（Scopus）

摘要

This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m². The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.

原文	英語
主出版物標題	ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
編輯	Bahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
發行者	IEEE Computer Society
頁面	236-242
頁數	7
ISBN（電子）	0780371526
DOIs	https://doi.org/10.1109/ITHERM.2002.1012463
出版狀態	已出版 - 2002
事件	8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, 美國持續時間: 30 05 2002 → 01 06 2002

出版系列

名字	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
卷	2002-January
ISSN（列印）	1936-3958

Conference

Conference	8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
國家/地區	美國
城市	San Diego
期間	30/05/02 → 01/06/02

文獻附註

Publisher Copyright:
© 2002 IEEE.

存取文件

10.1109/ITHERM.2002.1012463

其它文件與鏈接

Link to publication in Scopus

引用此

Chien, L. H., & Chang, C. C. (2002). Experimental study of evaporation resistance on porous surfaces in flat heat pipes. 於 B. G. Sammakia, Y. K. Joshi, G. Subbarayan, C. H. Amon, K. Ramakrishna, & S. B. Sathe (編輯), ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (頁 236-242). 文章 1012463 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; 卷 2002-January). IEEE Computer Society. https://doi.org/10.1109/ITHERM.2002.1012463

Chien, Liang Han ; Chang, C. C. / Experimental study of evaporation resistance on porous surfaces in flat heat pipes. ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 編輯 / Bahgat G. Sammakia ; Yogendra K. Joshi ; Ganesh Subbarayan ; Cristina H. Amon ; Koneru Ramakrishna ; Sanjeev B. Sathe. IEEE Computer Society, 2002. 頁 236-242 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

@inproceedings{d3d7ccb4d800462e88c8f9be78e18cd4,

title = "Experimental study of evaporation resistance on porous surfaces in flat heat pipes",

abstract = "This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m2. The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.",

keywords = "Coatings, Electronics cooling, Heat sinks, Heat transfer, Resistance heating, Surface resistance, Temperature, Testing, Thermal conductivity, Thermal resistance",

author = "Chien, {Liang Han} and Chang, {C. C.}",

note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",

year = "2002",

doi = "10.1109/ITHERM.2002.1012463",

language = "英语",

series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",

publisher = "IEEE Computer Society",

pages = "236--242",

editor = "Sammakia, {Bahgat G.} and Joshi, {Yogendra K.} and Ganesh Subbarayan and Amon, {Cristina H.} and Koneru Ramakrishna and Sathe, {Sanjeev B.}",

booktitle = "ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems",

address = "美国",

}

Chien, LH & Chang, CC 2002, Experimental study of evaporation resistance on porous surfaces in flat heat pipes. 於 BG Sammakia, YK Joshi, G Subbarayan, CH Amon, K Ramakrishna & SB Sathe (編輯), ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems., 1012463, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, 卷 2002-January, IEEE Computer Society, 頁 236-242, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002, San Diego, 美國, 30/05/02. https://doi.org/10.1109/ITHERM.2002.1012463

Experimental study of evaporation resistance on porous surfaces in flat heat pipes. / Chien, Liang Han; Chang, C. C.
ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 編輯 / Bahgat G. Sammakia; Yogendra K. Joshi; Ganesh Subbarayan; Cristina H. Amon; Koneru Ramakrishna; Sanjeev B. Sathe. IEEE Computer Society, 2002. p. 236-242 1012463 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; 卷 2002-January).

研究成果: 圖書/報告稿件的類型 › 會議稿件 › 同行評審

TY - GEN

T1 - Experimental study of evaporation resistance on porous surfaces in flat heat pipes

AU - Chien, Liang Han

AU - Chang, C. C.

PY - 2002

Y1 - 2002

N2 - This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m2. The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.

AB - This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m2. The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.

KW - Coatings

KW - Electronics cooling

KW - Heat sinks

KW - Heat transfer

KW - Resistance heating

KW - Surface resistance

KW - Temperature

KW - Testing

KW - Thermal conductivity

KW - Thermal resistance

UR - http://www.scopus.com/inward/record.url?scp=84950161744&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2002.1012463

DO - 10.1109/ITHERM.2002.1012463

M3 - 会议稿件

AN - SCOPUS:84950161744

T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

SP - 236

EP - 242

BT - ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

A2 - Sammakia, Bahgat G.

A2 - Joshi, Yogendra K.

A2 - Subbarayan, Ganesh

A2 - Amon, Cristina H.

A2 - Ramakrishna, Koneru

A2 - Sathe, Sanjeev B.

PB - IEEE Computer Society

T2 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002

Y2 - 30 May 2002 through 1 June 2002

ER -

Chien LH, Chang CC. Experimental study of evaporation resistance on porous surfaces in flat heat pipes. 於 Sammakia BG, Joshi YK, Subbarayan G, Amon CH, Ramakrishna K, Sathe SB, 編輯, ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. IEEE Computer Society. 2002. p. 236-242. 1012463. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). doi: 10.1109/ITHERM.2002.1012463

Experimental study of evaporation resistance on porous surfaces in flat heat pipes

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