Experimental study of evaporation resistance on porous surfaces in flat heat pipes

Liang Han Chien, C. C. Chang

研究成果: 圖書/報告稿件的類型會議稿件同行評審

13 引文 斯高帕斯(Scopus)

摘要

This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m2. The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.

原文英語
主出版物標題ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
編輯Bahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
發行者IEEE Computer Society
頁面236-242
頁數7
ISBN(電子)0780371526
DOIs
出版狀態已出版 - 2002
事件8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, 美國
持續時間: 30 05 200201 06 2002

出版系列

名字InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
2002-January
ISSN(列印)1936-3958

Conference

Conference8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
國家/地區美國
城市San Diego
期間30/05/0201/06/02

文獻附註

Publisher Copyright:
© 2002 IEEE.

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