Fabrication and Thermal Analysis of Flip Chip Light Emitting Diodes with Different Numbers of Au Stub Bumps

Cheng-Chen Lin, Xin-Hong Qian, Liann-Be Chang, Chung-Yi Tang, Ming-Yi Tsai

研究成果: 會議稿件的類型會議論文

原文美式英語
出版狀態已出版 - 2009
事件2009 International Electron Devices and Materials Symposia (IEDMS 2009) - Taoyuan, Taiwan
持續時間: 19 11 200920 11 2009

Conference

Conference2009 International Electron Devices and Materials Symposia (IEDMS 2009)
期間19/11/0920/11/09

引用此