Fluorinated CMOS HfO2 for high performance (HP) and low stand-by power (LSTP) application by pre- and post-CF4 Plasma Passivation

Woei Cherng Wu*, Chao Sung Lai, Huai Hsien Chiu, Jer Chyi Wang, Pai Chi Chou, Tien Sheng Chao

*此作品的通信作者

研究成果: 圖書/報告稿件的類型會議稿件同行評審

1 引文 斯高帕斯(Scopus)

摘要

Fluorine distribution engineering in HfO2 to get higher performance (HP EOT=1.2nm) and low stand-by power (LSTP EOT=1.8nm) CMOS device with 48% driving current enhancement for HP, 73% leakage reduction for LSTP were demonstrated. Better uniformity (50% VtU and 9% IdU reduction) and excellent reliability, P/NBTI, of n-/p-MOSFET were achieved A new physical model of fluorine re-incorporation was proposed to explain the turnaround of NBTI and the much improvement of NBTI for HP and LP device.

原文英語
主出版物標題2010 Proceedings of the European Solid State Device Research Conference, ESSDERC 2010
頁面416-419
頁數4
DOIs
出版狀態已出版 - 2010
事件2010 European Solid State Device Research Conference, ESSDERC 2010 - Sevilla, 西班牙
持續時間: 14 09 201016 09 2010

出版系列

名字2010 Proceedings of the European Solid State Device Research Conference, ESSDERC 2010

Conference

Conference2010 European Solid State Device Research Conference, ESSDERC 2010
國家/地區西班牙
城市Sevilla
期間14/09/1016/09/10

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