Grinding performances of electroplated diamond tools with one- and two-layered D-150-diamond particles

研究成果: 會議稿件的類型 › 會議論文

原文	美式英語
出版狀態	已出版 - 2024
事件	2024 8th International Conference on Material Engineering and Manufacturing (ICMEM 2024) - Osaka, Japan 持續時間: 22 03 2024 → 25 03 2024

Conference	2024 8th International Conference on Material Engineering and Manufacturing (ICMEM 2024)
期間	22/03/24 → 25/03/24

引用此

@conference{661ea49477ab42af800c4419706e611b,

title = "Grinding performances of electroplated diamond tools with one- and two-layered D-150-diamond particles",

author = "Ching-An Huang",

year = "2024",

language = "American English",

note = "2024 8th International Conference on Material Engineering and Manufacturing (ICMEM 2024) ; Conference date: 22-03-2024 Through 25-03-2024",

}