High-linearity performance of 0.13-μm CMOS devices using field-plate technology

This letter presents high-linearity 0.13-μm CMOS devices based on field-plate technology. The field-plate technology reduces the electric field between the gate and drain terminals, subsequently forming a field-plate-induced depletion region and reducing the leakage current to significantly improve linearity and power of the CMOS devices. The third-order intermodulation product of 0.13-μm NMOS devices with and without field-plate technology are -41.8 and -32.4 dBm, respectively, for input power of -10 dBm. Experimental results indicate that the field-plate architecture exhibits high linearity and power for CMOS RFIC applications.