摘要
In this study, a AlGaN/GaN high-electron-mobility transistor (HEMT) grown on the bulk GaN substrate was demonstrated and compared against one grown on the SiC substrate. Results of X-ray diffraction and reciprocal space mapping revealed that the bulk GaN substrate structure exhibited less lattice dislocation. The GaN substrate device demonstrated better IDS–VGS and gm–VGS characteristics of IDS = 700 mA/mm at VGS = +2 V and gmmax = 148 mS/mm. Compared with the SiC substrate, the current density in the HEMT grown on GaN was improved. The GaN substrate also improved current collapse and dynamic ON-state resistance due to a decrease in the trapping effect. The low-frequency noise and Hooge results also indicated that the GaN substrate had lower lattice dislocation.
| 原文 | 英語 |
|---|---|
| 出版狀態 | 已出版 - 2019 |
| 事件 | 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 - Minneapolis, 美國 持續時間: 29 04 2019 → 02 05 2019 |
Conference
| Conference | 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 |
|---|---|
| 國家/地區 | 美國 |
| 城市 | Minneapolis |
| 期間 | 29/04/19 → 02/05/19 |
文獻附註
Publisher Copyright:© 2019 CS Mantech. All rights reserved.
指紋
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