Improved resistance memory characteristics and switching mechanism using TiN electrode on TaOx/W structure

A. Prakash, S. Maikap*

*此作品的通信作者

研究成果: 圖書/報告稿件的類型會議稿件同行評審

2 引文 斯高帕斯(Scopus)

摘要

Improvement in the resistive switching characteristics using TiN bottom electrode on TaOx/W structure as compared to W electrode is reported. The thickness of TaOx layer is confirmed by high-resolution TEM image. The memory device with TiN electrode has shown formation-free repeatable bipolar resistive switching with resistance ratio of >30. Besides, improved resistive switching performance in terms of lower operation current (50 vs. 300 μ), longer read endurance (>105 cycles), 85 °C data retention of > 104 seconds and device yield of >90% is also achieved for TiN electrode. The TiN/TaOx interface is playing a key role in controlling the oxygen vacancy defects which in turn control the formation/dissolution of conducting filament.

原文英語
主出版物標題Proceedings of the 2013 IEEE 5th International Nanoelectronics Conference, INEC 2013
頁面136-138
頁數3
DOIs
出版狀態已出版 - 2013
事件2013 IEEE 5th International Nanoelectronics Conference, INEC 2013 - Singapore, 新加坡
持續時間: 02 01 201304 01 2013

出版系列

名字Proceedings - Winter Simulation Conference
ISSN(列印)0891-7736

Conference

Conference2013 IEEE 5th International Nanoelectronics Conference, INEC 2013
國家/地區新加坡
城市Singapore
期間02/01/1304/01/13

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