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Injection molding of delamination-free ultra-high-molecular-weight polyethylene

  • Galip Yilmaz
  • , Huaguang Yang
  • , Lih Sheng Turng*
  • *此作品的通信作者
  • University of Wisconsin-Madison
  • Beijing University of Chemical Technology

研究成果: 期刊稿件文章同行評審

19 引文 斯高帕斯(Scopus)

摘要

When ultra-high-molecular-weight polyethylene (UHMWPE) in powder form is injection molded, the so-called delamination layering occurs near the skin of the parts. This layering defect hampers UHMWPE's superior wear resistance property and part surface quality. The delamination layer was caused by a combination of excessive shear stress near the part surface and high degree of molecular entanglement of UHMWPE. A mold insulation method that delays the rapid cooling of UHMWPE to reduce the shear stress and improve the polymer chain “interdiffusion” across the entangled chain bundles was used to eliminate the delamination layer. When the insulation layer thickness and mold temperature were optimized, the delamination layer was eliminated completely while still maintaining a reasonable cooling/cycle time. The delamination-free parts were found to regain UHMWPE's superior impact resistance and tensile properties. POLYM. ENG. SCI., 59:2313–2322, 2019.

原文英語
頁(從 - 到)2313-2322
頁數10
期刊Polymer Engineering and Science
59
發行號11
DOIs
出版狀態已出版 - 01 11 2019
對外發佈

文獻附註

Publisher Copyright:
© 2019 Society of Plastics Engineers

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