Investigation on cu TSV-induced KOZ in silicon chips: Simulations and experiments
Ming Yi Tsai, Pu Shan Huang, Chen Yu Huang, Hsiu Jao, Brady Huang, Blacksmith Wu, Yuan Yuan Lin, Will Liao, Joe Huang, Lawrence Huang, Steven Shih, Jeng Ping Lin
研究成果: 期刊稿件 › 文章 › 同行評審
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引文
斯高帕斯(Scopus)