跳至主導覽 跳至搜尋 跳過主要內容

Low insertion loss switch technology using 6-inch InGaP/AlGaAs/InGaAs pHEMT production process

  • H. C. Chiu*
  • , T. J. Yeh
  • , Y. Y. Hsieh
  • , Tony Hwang
  • , Paul Yeh
  • , C. S. Wu
  • *此作品的通信作者
  • WIN Semiconductors Corp.

研究成果: 圖書/報告稿件的類型會議稿件同行評審

9 引文 斯高帕斯(Scopus)

摘要

A high yield low insertion loss switch (LIL switch) for GSM and WLAN applications was demonstrated by using 0.5 μm gate length InGaP/AlGaAs/ InGaAs pHEMT technology. In order to improve the chip yield during gate recess process, the high-selectivity InGaP Schottky layer design was applied in this study. Besides, ordering type InGaP Schottky layer also provides an extreme lower ΔEc (<0.1eV) as compared with AlGaAs ones and this character is helpful to improve contact resistance and insertion loss performance of switch. The fabricated LIL switch IC achieved a low insertion loss of 0.18 dB under a 0.9 GHz operation. In addition, the output power density of this proposed InGaP/AlGaAs/InGaAs pHEMT has demonstrated 284mW/mm under Vds of 3V at 2GHz operation. Therefore, this 6-inch production pHEMT switch process exhibited a high potential in LIL switch and PA MMIC design for GSM and WLAN applications.

原文英語
主出版物標題IEEE Compound Semiconductor Integrated Circuit Symposium; 2004 IEEE CSIC Symposium, 26th Anniversary
主出版物子標題Compounding Your Chips in Monterey - Technical Digest 2004
頁面119-122
頁數4
DOIs
出版狀態已出版 - 2004
事件IEEE Compound Semiconductor Integrated Circuit Symposium; 2004 IEEE CSIC Symposium - Monterey, CA, 美國
持續時間: 24 10 200427 10 2004

出版系列

名字Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC
ISSN(列印)1550-8781

Conference

ConferenceIEEE Compound Semiconductor Integrated Circuit Symposium; 2004 IEEE CSIC Symposium
國家/地區美國
城市Monterey, CA
期間24/10/0427/10/04

指紋

深入研究「Low insertion loss switch technology using 6-inch InGaP/AlGaAs/InGaAs pHEMT production process」主題。共同形成了獨特的指紋。

引用此