Low temperature wafer bonding in medium vacuum

S.S. Deng, Cher-Ming Tan, J. Wei, W.B. Yu

研究成果: 期刊稿件 › 文章 › 同行評審

原文	美式英語
頁（從 - 到）	303-307
期刊	American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
卷	4
出版狀態	已出版 - 2004

引用此

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title = "Low temperature wafer bonding in medium vacuum",

author = "S.S. Deng and Cher-Ming Tan and J. Wei and W.B. Yu",

year = "2004",

language = "American English",

volume = "4",

pages = "303--307",

journal = "American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP",

issn = "1071-6947",

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TY - JOUR

T1 - Low temperature wafer bonding in medium vacuum

AU - Deng, S.S.

AU - Tan, Cher-Ming

AU - Wei, J.

AU - Yu, W.B.

PY - 2004

Y1 - 2004

M3 - Journal Article

SN - 1071-6947

VL - 4

SP - 303

EP - 307

JO - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

JF - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

ER -