LTCC multilayered substrate-integrated waveguide filter with enhanced frequency selectivity for system-in-package applications

Kuo Sheng Chin, Chih Chun Chang, Cheng Hua Chen, Zengxu Guo, Desong Wang, Wenquan Che

研究成果: 期刊稿件文章同行評審

77 引文 斯高帕斯(Scopus)

摘要

This paper presents a cross-coupled bandpass filter with stacked substrate-integrated waveguide cavities on low-temperature cofired ceramic substrates. The proposed filter has a local multipoint distribution service band with a novel same-side-feed input/output structure. Conventionally, a cross-coupled structure generates only a single pair of transmission zeros. The proposed filter can generate two pairs of transmission zeros beside the passband, thereby providing an excellent cutoff rate in the stopband and improved frequency selectivity. The additional pair of transmission zeros is created by the same-side-feed structure, which constructs an additional source-load coupling path without increasing the circuit size. A multipath coupling diagram is used to illustrate the conformation of the second pair of transmission zeros and predict its behavior. The experimental filter exhibits responses centered at 27.95 GHz with an insertion loss of {-}{\rm 2.8}~{\rm dB}, and a bandwidth of 9%. Two pairs of transmission zeros (at 26.3 and 29.6 GHz, and at 23.2 and 37 GHz) around the passband were obtained, achieving excellent selectivity and a wide stopband.

原文英語
文章編號6693732
頁(從 - 到)664-672
頁數9
期刊IEEE Transactions on Components, Packaging and Manufacturing Technology
4
發行號4
DOIs
出版狀態已出版 - 04 2014

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