摘要
During the injection molding process, the effect of the processing conditions, the material behavior as well as the geometric effects should be accounted in order to predict the residual stress and warpage in a polymer product. Up to date, several numerical models have been proposed to simulate the formation of thermally induced residual stresses. In this paper, an approach is proposed to examine the thermally induced stress and warpage problem using a novel material description and a more comprehensive geometric description with the intent of either reaching or understanding more inclusive/realistic problems.
原文 | 英語 |
---|---|
頁面 | 684-701 |
頁數 | 18 |
出版狀態 | 已出版 - 1995 |
事件 | Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3) - Boston, MA, USA 持續時間: 07 05 1995 → 11 10 1995 |
Conference
Conference | Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3) |
---|---|
城市 | Boston, MA, USA |
期間 | 07/05/95 → 11/10/95 |