Modeling and simulation of thermally induced stress and warpage in injection molded thermoplastics

Shih Jung Liu*, J. X. Rietveld

*此作品的通信作者

研究成果: 會議稿件的類型論文同行評審

摘要

During the injection molding process, the effect of the processing conditions, the material behavior as well as the geometric effects should be accounted in order to predict the residual stress and warpage in a polymer product. Up to date, several numerical models have been proposed to simulate the formation of thermally induced residual stresses. In this paper, an approach is proposed to examine the thermally induced stress and warpage problem using a novel material description and a more comprehensive geometric description with the intent of either reaching or understanding more inclusive/realistic problems.

原文英語
頁面684-701
頁數18
出版狀態已出版 - 1995
事件Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3) - Boston, MA, USA
持續時間: 07 05 199511 10 1995

Conference

ConferenceProceedings of the 53rd Annual Technical Conference. Part 1 (of 3)
城市Boston, MA, USA
期間07/05/9511/10/95

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