@inproceedings{359be920953046b789200bde1c7a3f95,
title = "Optimization of the au stud bump number for the flip-chip packaged InGaN LEDs",
abstract = "Au stud bump can provide a good heat spreading path for the flip-chip LED due to its high thermal conductivity (300 W/mK) In this paper, we compared four flip-chip LED devices with four different numbers of Au stud bumps. The thermal imaging analysis indicates that the heat dissipation is proportional to the number of Au stud bump. However, when the number of Au stud bumps was larger than 24, the heat dissipation performance will become deteriorated due to the poor bonding between grain and substrate. Therefore, the number of Au stud bumps was optimized to be 20 to 24, which can be employed to develop flip-chip LEDs with optimum electrical and optical performance.",
keywords = "Au stud bumps, Flip-chip LED, Thermal analysis, Thermosonic bonding",
author = "Zhang, \{Yun Yun\} and Sun, \{Xiao Wei\} and Kuo, \{Wen Yu\} and Chang, \{Liann Be\} and Huang, \{Bohr Ran\} and Zhao, \{Jun Liang\} and Dai, \{Hai Tao\} and Wang, \{Shu Guo\}",
year = "2013",
doi = "10.4028/www.scientific.net/AMR.753-755.2515",
language = "英语",
isbn = "9783037857649",
series = "Advanced Materials Research",
pages = "2515--2520",
booktitle = "Materials Processing and Manufacturing III",
note = "3rd International Conference on Advanced Engineering Materials and Technology, AEMT 2013 ; Conference date: 11-05-2013 Through 12-05-2013",
}