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Performance of convolution neural network based on multiple GPUs with different data communication models

  • Che Lun Hung
  • , Yi Yang Lin
  • , Chuan Yi Tang
  • , Chilung Wang
  • , Ming Chiang Chen
  • Providence University Taiwan
  • Technology Research Institute

研究成果: 圖書/報告稿件的類型 › 會議稿件 › 同行評審

1 引文 斯高帕斯(Scopus)

摘要

Recently, deep learning technologies have been utilized in many scientific domains successfully. Convolution neural networks are common used in image understanding problems. However, to train a convolution neural network model with huge amount of images is time-consuming task. Most of deep learning frameworks, such as Caffe, TensorFlow, Torch, Keras, MxNet, and so forth, support GPU to train model fast; especially executing these models on multiple GPUs. In this work, we present the comparison of computation performance of AlexNet among different GPU servers and hyperparameters. The results shows that GPU servers with high bandwidth rate, NVLINK, can achieve better performance than others.

原文英語
主出版物標題Proceedings - 2018 IEEE/ACIS 19th International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2018
編輯Ha Jin Hwang, Lizhi Cai, Gun Huck Yeom, Tokuro Matsuo, Haeng Kon Kim, Hyun Yeo, Chung Sun Hong, Naoki Fukuta, Takayuki Ito, Huaikou Miao
發行者Institute of Electrical and Electronics Engineers Inc.
頁面87-92
頁數6
ISBN(列印)9781538658895
DOIs
出版狀態已出版 - 20 08 2018
對外發佈是
事件19th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2018 - Busan, 韓國
持續時間: 27 06 2018 → 29 06 2018

出版系列

名字Proceedings - 2018 IEEE/ACIS 19th International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2018

Conference

Conference19th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2018
國家/地區韓國
城市Busan
期間27/06/18 → 29/06/18

文獻附註

Publisher Copyright:
© 2018 IEEE.

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