Reconstructing the 3D solder paste surface model using image processing and artificial neural network

Fang Chung Yang*, Chung Hsien Kuo, Jein Jong Wing, Ching Kun Yang

*此作品的通信作者

研究成果: 圖書/報告稿件的類型會議稿件同行評審

14 引文 斯高帕斯(Scopus)

摘要

In general, the laser Inspection can measure accurate 3D solder paste surface model, however, it is not practical due to the high cost and low inspection speed. This paper presents the three-dimensional (3D) solder paste surface model reconstruction using the image processing and artificial neural network (ANN), and the proposed approach forms the virtual laser 3D automatic optical inspection (AOI) model. The input nodes of the ANN model consist of the image features that are captured from images of using different light sources. The output nodes are the heights of the corresponding image pixel areas. The training patterns of the proposed ANN model use the laser 3D inspection results. Meanwhile, the in-lab design and the commercial coaxial light sources with the pad and sub-area based learning architecture models are constructed and validated, and the estimated 3D surface model achieves 90% accuracy in average.

原文英語
主出版物標題2004 IEEE International Conference on Systems, Man and Cybernetics, SMC 2004
頁面3051-3056
頁數6
DOIs
出版狀態已出版 - 2004
事件2004 IEEE International Conference on Systems, Man and Cybernetics, SMC 2004 - The Hague, 荷蘭
持續時間: 10 10 200413 10 2004

出版系列

名字Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics
3
ISSN(列印)1062-922X

Conference

Conference2004 IEEE International Conference on Systems, Man and Cybernetics, SMC 2004
國家/地區荷蘭
城市The Hague
期間10/10/0413/10/04

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