Residual clamping force and dynamic random access memory data retention improved by gate tungsten etch dechucking condition in a bipolar electrostatic chuck

Chung Yuan Lee*, Chao Sung Lai, Chia Ming Yang, David H.L. Wang, Betty Lin, Siimon Lee, Chi Hung Huang, Chen Chang Wei

*此作品的通信作者

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3 引文 斯高帕斯（Scopus）

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Engineering

Material Science