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Scaling VDD for P-Type 2D-Material Channel Transistor: what Non-Idealities are Still to be Solved

  • Chao Ching Cheng*
  • , Ang Sheng Chou
  • , Edward Chen
  • , Ming Yang Li
  • , Yu Wei Hsu
  • , Chia Chin Cheng
  • , Seong Rae Cho
  • , Haomin Liu
  • , Po Sen Mao
  • , Wen Chia Wu
  • , Shuer Ku
  • , Wei Sheng Yun
  • , Chih Piao Chuu
  • , Wei Yen Woon
  • , Lain Jong Li
  • , Vincent Tung
  • , Chih I. Wu
  • , Iuliana Radu
  • , Min Cao
  • *此作品的通信作者
  • Taiwan Semiconductor Manufacturing Company
  • National Taiwan University
  • The University of Tokyo
  • National University of Singapore

研究成果: 圖書/報告稿件的類型會議稿件同行評審

摘要

This study investigates the effect of non-ideal factors in WSe2 2Dmaterial channel transistors, including interface traps (Dit), contact resistance (Rc), and band-tail states (SBT), on the threshold voltage (VT). For achieving the scaled VDD=0.75 V operation, reduction of multiple non-idealities is required beyond current state: (i) reducing Dit below 1E12 cm-2 eV-1 preserves the position of VTCC=-0.1 V (constant-current VT); (ii) suppressing the SB T through gate dielectric engineering, with scaled EOT below 1 nm, is required for setting correct VTCC and VTGM (transconductance-defined VT) positions; (iii) minimizing Rc to 100 Ω-μ m ensures the (VTGM-VTCC) gap below 0.28 V. The study combines these findings and offers insights to design the desired VT positions at scaled VDD for 2D materials.

原文英語
主出版物標題2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2026
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9798331580964
DOIs
出版狀態已出版 - 2026
對外發佈
事件2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2026 - Honolulu, 美國
持續時間: 14 06 202618 06 2026

出版系列

名字Digest of Technical Papers - Symposium on VLSI Technology
ISSN(列印)0743-1562
ISSN(電子)2158-9682

Conference

Conference2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2026
國家/地區美國
城市Honolulu
期間14/06/2618/06/26

文獻附註

Publisher Copyright:
© 2026 IEEE.

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