Simulation and optimization of MCM interconnections

W. S. Feng; S. Tenqchen; M. C. Cheng

doi:10.1109/ICMCM.1998.670776

Simulation and optimization of MCM interconnections

W. S. Feng, S. Tenqchen, M. C. Cheng

研究成果: 圖書/報告稿件的類型 › 會議稿件 › 同行評審

摘要

In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections.

原文	英語
主出版物標題	Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	178-183
頁數	6
ISBN（電子）	0780348508, 9780780348509
DOIs	https://doi.org/10.1109/ICMCM.1998.670776
出版狀態	已出版 - 1998
對外發佈	是
事件	7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998 - Denver, 美國持續時間: 17 04 1998 → …

出版系列

名字	Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging
卷	1998-April

Conference

Conference	7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998
國家/地區	美國
城市	Denver
期間	17/04/98 → …

文獻附註

Publisher Copyright:
© 1998 IEEE.

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10.1109/ICMCM.1998.670776

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Feng, W. S., Tenqchen, S., & Cheng, M. C. (1998). Simulation and optimization of MCM interconnections. 於 Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging (頁 178-183). (Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging; 卷 1998-April). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMCM.1998.670776

@inproceedings{91e934317d6a4ed69735c1158f738c56,

title = "Simulation and optimization of MCM interconnections",

abstract = "In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections.",

author = "Feng, {W. S.} and S. Tenqchen and Cheng, {M. C.}",

note = "Publisher Copyright: {\textcopyright} 1998 IEEE.; 7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998 ; Conference date: 17-04-1998",

year = "1998",

doi = "10.1109/ICMCM.1998.670776",

language = "英语",

series = "Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "178--183",

booktitle = "Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging",

address = "美国",

}

Feng, WS, Tenqchen, S & Cheng, MC 1998, Simulation and optimization of MCM interconnections. 於 Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging, 卷 1998-April, Institute of Electrical and Electronics Engineers Inc., 頁 178-183, 7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998, Denver, 美國, 17/04/98. https://doi.org/10.1109/ICMCM.1998.670776

Simulation and optimization of MCM interconnections. / Feng, W. S.; Tenqchen, S.; Cheng, M. C.
Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Institute of Electrical and Electronics Engineers Inc., 1998. p. 178-183 (Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging; 卷 1998-April).

研究成果: 圖書/報告稿件的類型 › 會議稿件 › 同行評審

TY - GEN

T1 - Simulation and optimization of MCM interconnections

AU - Feng, W. S.

AU - Tenqchen, S.

AU - Cheng, M. C.

PY - 1998

Y1 - 1998

N2 - In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections.

AB - In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections.

UR - http://www.scopus.com/inward/record.url?scp=85045400807&partnerID=8YFLogxK

U2 - 10.1109/ICMCM.1998.670776

DO - 10.1109/ICMCM.1998.670776

M3 - 会议稿件

AN - SCOPUS:85045400807

T3 - Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

SP - 178

EP - 183

BT - Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998

Y2 - 17 April 1998

ER -

Feng WS, Tenqchen S, Cheng MC. Simulation and optimization of MCM interconnections. 於 Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Institute of Electrical and Electronics Engineers Inc. 1998. p. 178-183. (Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging). doi: 10.1109/ICMCM.1998.670776

Simulation and optimization of MCM interconnections

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