Temperature dependency and reliability of through substrate via InAlN/GaN high electron mobility transistors as determined using low frequency noise measurement

The reliability of a InAlN/GaN/Si high electron mobility transistor device was studied using low frequency noise measurements under various stress conditions. By applying the through substrate via (TSV) technology beneath the active region of the device, buffer/transition layer trapping caused by the GaN/Si lattice mismatch was suppressed. In addition, a backside SiO2/Al heat sink material improved thermal stability and eliminated the vertical leakage current of the proposed device. Applying the TSV technology improved the subthreshold swing slope from 260 to 230mV/dec, owing to the stronger channel modulation ability and reduced leakage current of the device. The latticed-matched InAlN/GaN heterostructure had a stable performance after high current operation stress. The suppression of buffer/transition layer traps of the TSV device is a dominant factor in device reliability after long-term high-electric-field stress.