The corrosion behavior of Cu-Al and Cu-Al-Be shape-memory alloys in 0.5 M H2SO4 solution

H. H. Kuo, W. H. Wang*, Y. F. Hsu, C. A. Huang

*此作品的通信作者

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26 引文 斯高帕斯(Scopus)

摘要

The corrosion behavior of Cu-Al and Cu-Al-Be (0.55-1.0 wt%) shape-memory alloys in 0.5 M H2SO4 solution at 25 °C was studied by means of anodic polarization, cyclic voltammetry, and alternative current impedance measurements. The results of anodic polarization test show that anodic dissolution rates of alloys decreased slightly with increasing the concentrations of aluminum or beryllium. Severe intergranular corrosion of Cu-Al alloy was observed after alternative current impedance measurement performed at the anodic potential of 0.6 V. However, the addition of a small amount of beryllium was effective to prevent the intergranular corrosion. The effect of beryllium addition on the prevention of intergranular corrosion is possibly attributed to the diffusion of beryllium atoms into grain boundaries, which in turn deactivates the grain boundaries.

原文英語
頁(從 - 到)4352-4364
頁數13
期刊Corrosion Science
48
發行號12
DOIs
出版狀態已出版 - 12 2006

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