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Thin silicon light-addressable potentiometric sensor by Deep reactive-ion etching

  • Wei Yin Zeng
  • , Tsung Cheng Chen
  • , Hui Ling Liu
  • , Yu Ping Chen
  • , Chia Ming Yang*
  • *此作品的通信作者
  • Chang Gung University
  • Chang Gung Memorial Hospital

研究成果: 圖書/報告稿件的類型會議稿件同行評審

4 引文 斯高帕斯(Scopus)

摘要

To have a high photocurrent and spatial resolution of 2-dimensional (2D) chemical image in light-addressable potentiometric sensor (LAPS), silicon substrate is thinned down to about 100 μm by Deep reactive-ion etching (DRIE). Compare to commercial Si substrate with thickness of 350 μm, photocurrent is increased for 4.5 times and operation frequency is increased to 20 kHz. pH sensitivity is 67.09 mV/pH for NbOx sensing membrane. A clear 2D image to recognize a pattern with width of 100 μm can be obtained. Higher signal to noise ratio is benefit for high-speed and spatial resolution of 2D chemical image.

原文英語
主出版物標題TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1540-1542
頁數3
ISBN(電子)9781538627310
DOIs
出版狀態已出版 - 26 07 2017
事件19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, 台灣
持續時間: 18 06 201722 06 2017

出版系列

名字TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

Conference19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
國家/地區台灣
城市Kaohsiung
期間18/06/1722/06/17

文獻附註

Publisher Copyright:
© 2017 IEEE.

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