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Vertical GaN Schottky barrier diodes with ohmic contact on N-polar by the atomic layer deposition of aluminum oxide interfacial layer

  • Yongkai Yang
  • , Zhengweng Ma
  • , Zhongwei Jiang
  • , Bo Li
  • , Linfei Gao
  • , Shuai Li
  • , Qiubao Lin
  • , Hezhou Liu
  • , Wangying Xu
  • , Gaopan Chen
  • , Chunfu Zhang
  • , Zhihong Liu
  • , Hsien Chin Chiu
  • , Hao Chung Kuo
  • , Jin Ping Ao
  • , Xinke Liu*
  • *此作品的通信作者

研究成果: 期刊稿件文章同行評審

2 引文 斯高帕斯(Scopus)

摘要

In this paper, high-performance vertical GaN on GaN Schottky Barrier Diodes (SBDs) on 2-inch free-standing (FS)-GaN is presented with the specific on-state resistance (Ron) of 1.34 mΩ·cm2, breakdown voltage (Vbr) of 1150 V and figure of merit (FOM) of 0.98 GW/cm2. He-implanted edge termination (ET) structure is introduced to alleviate the peak electric field concentration effect at the anode edge of GaN SBDs. Furthermore, A new ohmic contact structure is explored by atomic layer deposition (ALD)-grown AlOx interfacial layer. Based on the self-cleaning effect of ALD and Ultra-thin AlOx interfacial layer, the Fermi-level Pinning (FLP) effect is alleviated effectively, the specific contact resistivity (ρc) on N-polar GaN was reduced from 1.63 × 10−3 to 7.14 × 10−5 Ω·cm2.The temperature variation test demonstrate the devices has potential of temperature sensors under high voltage and high temperature.

原文英語
文章編號161268
期刊Applied Surface Science
679
DOIs
出版狀態已出版 - 15 01 2025

文獻附註

Publisher Copyright:
© 2024 Elsevier B.V.

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