摘要
In designing high performance interconnect in high-density printed wired boards, one design criterion is to avoid voltage ringings and false logic switchings. In this paper, based on the geometry structures of the two coupled RLC interconnects, several systematic design procedures will be investigated to avoid voltage ringing phenomena. Experimental simulations will be preformed to demonstrate the feasibility of these methods.
原文 | 英語 |
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頁(從 - 到) | 148-153 |
頁數 | 6 |
期刊 | Proceedings of SPIE - The International Society for Optical Engineering |
卷 | 3830 |
出版狀態 | 已出版 - 1999 |
事件 | Proceedings of the 1999 International Conference on High Density Packaging and MCMs - Denver, CO, USA 持續時間: 06 04 1999 → 09 04 1999 |