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Warpage comparison between microcellular and conventional injection molding

  • Adam Kramschuster
  • , Ryan Cavitt
  • , Donald Ermer
  • , Zhongbao Chen
  • , Lih Sheng Turng*
  • *此作品的通信作者
  • University of Wisconsin-Madison

研究成果: 會議稿件的類型 › 論文 › 同行評審

3 引文 斯高帕斯(Scopus)

摘要

This research investigated the effects of processing conditions on the shrinkage and warpage (S&W) behavior of a box-shaped part using conventional and microcellular injection molding. Two sets of 2 6-1 fractional factorial DOE were employed to perform and analyze the experiments. After the machine and material reached the steady state condition, molded samples were collected and measured using an optical coordinate measuring machine (CMM). The results suggest that the supercritical fluid (SCF) content (in terms of SCF dosage time) and the injection speed affect the S&W of microcellular injection molded parts the most, whereas hold pressure and hold time have a greater influence on the S&W of conventional injection molded parts. This study also quantitatively showed that, within the processing range studied, an increase in dimensional stability could be achieved with the microcellular injection molding process.

原文英語
頁面151-155
頁數5
出版狀態已出版 - 2005
對外發佈是
事件Society of Plastics Engineers Annual Technical Conference 2005, ANTEC 2005 - Boston, MA, 美國
持續時間: 01 05 2005 → 05 05 2005

Conference

ConferenceSociety of Plastics Engineers Annual Technical Conference 2005, ANTEC 2005
國家/地區美國
城市Boston, MA
期間01/05/05 → 05/05/05

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